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Brand Name : | Ti |
Model Number : | TLV2374IDR |
Price : | Contact us |
Payment Terms : | Paypal, Western Union, TT |
Supply Ability : | 50000 Pieces per Day |
Delivery Time : | The goods will be shipped within 3 days once received fund |
TLV2374IDR Audio Power Amplifier IC Op Amps Quad 3MHz R/R
1 Features
Wide Bandwidth: 3 MHz
High Slew Rate: 2.4 V/μs
Supply Voltage Range: 2.7 V to 16 V
Supply Current: 550 μA/Channel
Low-Power Shutdown Mode
– IDD(SHDN): 25 μA/Channel
Input Noise Voltage: 39 nV/√Hz
Input Bias Current: 1 pA
Specified Temperature Range:
– −40°C to +125°C (Industrial Grade) • Ultra-Small Packaging:
– 5- or 6-Pin SOT-23 (TLV2370, TLV2371)
– 8- or 10-Pin MSOP (TLV2372, TLV2373)
2 Applications
White Goods
Handheld Test Equipment
Portable Blood Glucose Systems
Remote Sensing
Active Filters
Industrial Automation
Battery-Powered Electronics
3 Description
The TLV237x single-supply operational amplifiers provide rail-to-rail input and output capability. The TLV237x takes the minimum operating supply voltage down to 2.7 V over the extended industrial temperature range while adding the rail-to-rail output swing feature. The TLV237x also provides 3-MHz bandwidth from only 550 μA. The maximum recommended supply voltage is 16 V, which allows the devices to be operated from (±8-V supplies down to ±1.35 V) a variety of rechargeable cells.
The CMOS inputs enable use in high-impedance sensor interfaces, with the lower voltage operation making an ideal alternative for the TLC227x in battery-powered applications. The rail-to-rail input stage further increases its versatility. The TLV237x is the seventh member of a rapidly growing number of RRIO products available from TI, and it is the first to allow operation up to 16-V rails with good ac performance.
All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP, and quads in the TSSOP package.
The 2.7-V operation makes the TLV237x compatible with Li-Ion powered systems and the operating supply voltage range of many micro-power microcontrollers available today including TI’s MSP430.
Device Information
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
TLV237x | PDIP (8) | 9.81 mm × 6.35 mm |
PDIP (14) | 19.30 mm × 6.35 mm | |
SOIC (8) | 4.90 mm × 3.91 mm | |
SOIC (14) | 8.65 mm × 3.91 mm | |
TSSOP (14) | 5.00 mm × 4.40 mm | |
TSSOP (16) | ||
SOT-23 (6) | 2.90 mm × 1.60 mm | |
SOT-23 (5) | ||
VSSOP (8) | 3.00 mm × 3.00 mm | |
VSSOP (10) |
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